New Delhi: In a bid to help smartphone players bring premium features to mid-range devices in India, Taiwanese chipmaker MediaTek on Tuesday showcased several future-ready smart technologies here.
The company showcased “Sensio MT6381” — a six-in-one biosensor module that can easily be incorporated into smartphone designs and give users access anywhere to monitor their health.
The global fabless semiconductor leader also displayed new chipset designs — including MT 6739 and Helio P23 — that offers technologies like dual-SIM and dual-VoLTE, dual camera, photo and video enhancements, extended battery life, higher performance and improved connectivity.
“India is a market of immense opportunities with its own set of aspirations and needs. We continue to intensify our technology collaboration in India, even beyond smartphones, and recognise its importance in the global marketplace,” said TL Lee, General Manager, Wireless Communication, MediaTek.
In order to strengthen design capabilities among companies in India, the second “MediaTek Smartphone Design Training Programme” was announced late last year, along with the Ministry of Electronics and Information Technology (MeitY).
“MediaTek is already powering smartphones that have high-end features yet affordable to all. We will continue to innovate on the smartphone side this year in India to deliver devices that have become the primary access point for a connected lifestyle,” Lee added.
Mid-range devices today are catching up with flagship smartphones in terms of features, capabilities and power consumption.
In order to fulfil such needs, the MediaTek MT6739 chip has face detection capabilities. The high-speed quad-core System on Chips (SoCs) are built for India’s rapidly growing 4G market.
In December, MediaTek became the first SoC partner to provide Google’s Android Oreo (Go edition) solution to the Indian mobile manufacturers.
MediaTek “Sensio MT6381” is a comprehensive software and module solution designed specifically to deliver valuable health data, consisting of optical, electrical and processing components.
With “Sensio”, manufacturers will be able to develop proprietary applications or leverage third-party applications and developer add-ons, the company said.